Semiconductor Plating DSA
Product Name: Semiconductor Plating DSA
Product overview: roll-to-roll plating, contact device plating, lead frame plating, electropolishing, selective spot plating, etc.
Product features: It can be selected and customized according to your own needs. The shape of the anode can be customized according to customer requirements.
Highlights: long life, low energy consumption, superior plating uniformity, low comprehensive use cost, and high-cost performance.
Applicable scenarios: Semiconductor component plating: roll-to-roll plating, contact device plating, lead frame plating, electropolishing, selective spot plating, etc.
Application conditions: Electrolyte: acidic/cyanide system, gloss agent & other additives PH: 4-5; temperature 30℃-70℃;
Current density: 250-30000A/m2;
Coating type: mixed precious metal coating anode plating platinum anode, the platinum thickness can be lum-10um, or even thicker.
Product after-sales and service: We provide timely and high-quality new anode manufacturing and old anode recoating services globally.
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